| 发明名称 |
CIRCUIT BOARD ASSEMBLY USING METAL PLATES AS CONDUCTING MEDIUM EMBEDDED THEREIN |
| 摘要 |
A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop. |
| 申请公布号 |
US2014233189(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
US201313868575 |
申请日期 |
2013.04.23 |
| 申请人 |
KING SHING INDUSTRIAL CO., LTD |
发明人 |
SHIN Chun-Chin |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board assembly comprising:
metal plates to be used as conducting medium; an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection; and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop. |
| 地址 |
Taoyuan County TW |
