| 摘要 |
Provided is technology which, using a simple configuration, reduces the quantity of particles adhering to a substrate. A substrate processing device (10) is a device which discharges a processing liquid from a nozzle (11) so as to process a substrate (9). The substrate processing device (10) is provided with a supply pipe (30) and a bubble capture unit (F2). One end of the supply pipe (30), via a first filter (F1) which removes particles, is connected to a tank (21) of a processing liquid supply unit (20) which supplies the processing liquid, and the other end of the supply pipe (30) is connected to the nozzle (11). The bubble capture unit (F2) is interposed at a position between the first filter (F1) and the nozzle (11) on the supply pipe (30), and captures bubbles (Ba1) included in the processing liquid. Pressure loss (PL2) by way of the bubble capture unit (F2) is substantially the same or less than pressure loss (PL1) by way of the first filter (F1). |
