RESIN MULTI-LAYER SUBSTRATE WITH BUILT-IN COMPONENT, AND RESIN MULTI-LAYER SUBSTRATE

摘要

Provided is a resin multi-layer substrate with built-in component which is capable of improving reliability of a connection between a composite substrate and the resin multi-layer substrate. A resin multi-layer substrate with built-in component (101) is provided with a resin multi-layer substrate (2), and a composite substrate (3). The resin multi-layer substrate (2) is formed by stacking a plurality of resin layers (21), a wire (8) is formed in the interior of the substrate, and a cavity is formed in the main surface (4) thereof. The composite substrate (3) includes components (32), a core substrate (31) mounting the components (32), and connection terminals (9) which electrically connect the wire (8) and the core substrate (31). The wire (8) includes side surface electrodes (29) which are exposed on inner side surfaces of the cavity. The connection terminals (9) are exposed on outer side surfaces (39) of the composite substrate, and are electrically connected to the side surface electrodes (29).