| 摘要 |
The present invention relates to a wafer lift apparatus capable of reducing heat transferred to a susceptor on which a wafer is loaded from pins supporting the wafer. The present invention provides the wafer lift apparatus which lifts up the wafer to be loaded on the susceptor supported by a supporter while supporting the wafer and which comprise a lifting shaft installed on the shaft circumference of the supporter to be able to be lifted; a plurality of upper lifting pins caught by the susceptor to be able to be lifted and capable of supporting the wafer; and a plurality of lower lifting pins provided on the lifting shaft to be placed on the lower sides of the lifting pins and lifting the upper lifting pins along with the movement of the lifting shaft while being combined with the upper pins. When the wafer is loaded on the susceptor, the upper lifting pins are caught by the susceptor while the lower lifting pins are separated from the upper lifting pins. |
