| 摘要 |
PROBLEM TO BE SOLVED: To achieve laser-based modification of target material of a workpiece while achieving an improvement in processing throughput and/or quality.SOLUTION: Laser pulses are focused and directed to a region of the workpiece at a sufficiently high pulse repetition rate, so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. In one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier and fiber laser. Various embodiments are suitable for performing at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or optional materials to be micromachined with femtosecond/or picosecond pulses, or with up to several nanosecond pulse width in several embodiments. |
