| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate with a built-in electronic component, which can be thinned.SOLUTION: The substrate with a built-in electronic component comprises: a first substrate; an electronic component mounted on the first substrate; a first resin which is provided on the first substrate and covers a side surface of the electronic component; a second substrate which is provided above the electronic component and the first resin and is laminated on the first substrate; a substrate connection member which is provided between the first substrate and the second substrate and electrically connects the first substrate and the second substrate; a second resin filled between the second substrate and both the electronic component and the first resin; and a third resin which encapsulates the substrate connection member, the electronic component, the first resin, and the second resin and is filled between the first substrate and the second substrate. |
