| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element having a highly-reliable lamination structure.SOLUTION: A semiconductor light-emitting element comprises: a supporting body 21; a first bonding layer placed on the supporting body; a second bonding layer placed on the first bonding layer; a semiconductor structure layer 14 placed on the second bonding layer and including an active layer 12; and an encapsulation part 19 placed between the first bonding layer and the second bonding layer. The encapsulation part is provided at an outer peripheral part of a bonding region where the first bonding layer and the second bonding layer are bonded, and is adhered to the first bonding layer and the second bonding layer over the whole periphery. |
