发明名称 POST-CMP CLEANING APPARATUS AND METHOD
摘要 A brush for cleaning of substrates such as for post chemical mechanical polishing (post-CMP) of the substrates, utilizes asymmetrical nodules or nodules with varying spacing, size, features, densities to provide an improved cleaning of substrates.
申请公布号 US2014230170(A1) 申请公布日期 2014.08.21
申请号 US201214347170 申请日期 2012.09.26
申请人 ENTEGRIS, INC. 发明人 Patel Chintan
分类号 H01L21/67 主分类号 H01L21/67
代理机构 代理人
主权项 1. A brush for cleaning of substrates following chemical mechanical polishing of the substrates, the brush having a cylindrical base having an axis with a pair of ends, the cylindrical shape extending from end to end, and a plurality of nodules extending from the cylindrical base and being unitary therewith, the brush having an intended direction of rotation whereby each nodule has a forward side and a rearward side, the cylindrical base and nodules comprising a unitary porous foam structure, the plurality of the nodules each having a shape that is asymmetrical with respect to a radially and axially extending plane extending centrally through each respective nodule and through the axis of the cylindrical base.
地址 Billerica MA US