RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

摘要

The present invention relates to a resin composition which is characterized by containing: a reaction product which contains a polyphenylene ether (A) having an average of 1.5-2 hydroxyl groups per molecule and an epoxy compound (B) having an average of 2-2.3 epoxy groups per molecule, and which is obtained by causing at least some hydroxyl groups of the polyphenylene ether (A) to react with the epoxy groups of the epoxy compound (B) in advance so that the terminal hydroxyl group concentration of the polyphenylene ether (A) is 700 μmol/g or less; a cyanate ester compound (C); and an organic metal salt (D).