| 摘要 |
PROBLEM TO BE SOLVED: To polish stably by preventing a wafer 1 from deviating from a wafer holding part 3 of a carrier 2 at the time of double-sided polishing.SOLUTION: In a wafer polishing method, at an opening 9 opening toward a plate thickness direction, a carrier 2 on which a wafer 1 is mounted is sandwiched between an upper surface plate 4 and a lower surface plate 5, the upper surface plate 4 is relatively pressed against the lower surface plate 5, and both surfaces of the wafer 1 are polished simultaneously by relatively moving the upper surface plate 4 and the lower surface plate 5 with respect to the carrier 2. In this case, by making a region around the opening 9 of the carrier 2 a wafer holding part 3, the method includes: a first polishing step S1 of polishing the wafer holding part 3 which is thicker than the thickness of the wafer 1 until it becomes the thickness of the wafer 1; and a second polishing step S2 of polishing the wafer holding part 3 and the wafer 1 together at the same thickness. |
