发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM |
摘要 |
A thin film that has a predetermined composition and containing predetermined elements is formed on a substrate by performing a cycle of steps a predetermined number of times, said cycle comprising: a step wherein a first layer containing the predetermined elements, nitrogen and carbon is formed on the substrate by alternately performing, a predetermined number of times, a process of supplying a first source gas containing a predetermined element and a halogen group to the substrate and a process of supplying a second source gas containing a predetermined element and an amino group to the substrate; a step wherein a second layer is formed by modifying the first layer by supplying an amine-based source gas to the substrate; and a step wherein a third layer is formed by modifying the second layer by supplying a reaction gas that is different from the source gases to the substrate. |
申请公布号 |
US2014235067(A1) |
申请公布日期 |
2014.08.21 |
申请号 |
US201214351785 |
申请日期 |
2012.09.24 |
申请人 |
Hitachi Kokusai Electric Inc. |
发明人 |
Shimamoto Satoshi;Hirose Yoshiro;Sano Atsushi |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a semiconductor device, the method comprising forming a thin film having a predetermined composition and containing a predetermined element on a substrate by performing a cycle a predetermined number of times, the cycle comprising:
forming a first layer containing the predetermined element, nitrogen and carbon on the substrate by alternately performing a predetermined number of times: supplying a first source gas containing the predetermined element and a halogen group to the substrate in a process chamber; and supplying a second source gas containing the predetermined element and an amino group to the substrate in the process chamber; forming a second layer by modifying the first layer by supplying an amine-based source gas to the substrate in the process chamber; and forming a third layer by modifying the second layer by supplying a reactive gas different from the first source gas, the second source gas and the amine-based source gas to the substrate in the process chamber. |
地址 |
Chiyoda-ku, Tokyo JP |