发明名称 ELECTROHYDRODYNAMIC AIRFLOW ACROSS A HEAT SINK USING A NON-PLANAR ION EMITTER ARRAY
摘要 A method of cooling a heat generating device includes positioning a base of an electronically conductive heat sink in thermal communication with a heat generating device, wherein the heat sink includes a plurality of fins extending in a longitudinal direction from a first end to a second end, and coupling the heat sink to ground. The method further includes emitting ions from a plurality of ion emitter elements disposed in a non-planar pattern along the first ends of the plurality of fins, wherein at least three ion emitter elements are equidistant from the first end of the nearest fin and are positioned in an arc having an axis that extends along the first end of the nearest fin.
申请公布号 US2014230234(A1) 申请公布日期 2014.08.21
申请号 US201414264092 申请日期 2014.04.29
申请人 International Business Machines Corporation 发明人 June Michael S.;Ni Chunjian;Adams Dana S.R.;Steinke Mark E.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A method of cooling a heat generating device, comprising: positioning a base of an electronically conductive heat sink in thermal communication with a heat generating device, wherein the heat sink includes a plurality of fins extending in a longitudinal direction from a first end to a second end; coupling the heat sink to ground; and emitting ions from a plurality of ion emitter elements disposed in a non-planar pattern along the first ends of the plurality of fins, wherein at least three ion emitter elements are equidistant from the first end of the nearest fin and are positioned in an arc having an axis that extends along the first end of the nearest fin.
地址 Armonk NY US
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