Cooling arrangement for use in cooling system for power semiconductor module, has main body including fluid port that transitions at specific angle to one side surface of main body, and emerges into connection space for cooling channels

摘要

The arrangement (1) has a liquid cooling device (3) including a main body (30) with a main surface (300), two side surfaces (302, 303) and two longitudinal surfaces (304, 305). A power semiconductor module (2) is thermally and conductively connected to the main body, where cooling channels (32) extend from one side surface to the other side surface. The main body includes a fluid port (34) on one longitudinal surface, where the fluid port transitions at an angle between 30 and 75 degrees to one side surface and emerges into a connection space (420) for the cooling channels. Independent claims are also included for the following: (1) a cooling system (2) a method for manufacturing a cooling arrangement.