| 摘要 |
<p>The device (1) has a holding, recording and/or guide unit that is provided for holding, loading and/or guiding an adhesive band (2). A cutting edge is formed, such that held, recorded and/or guided adhesive band is oriented in preferential section direction parallel to longitudinal direction. A covering layer is displaced from adhesive band without cutting a carrier material. The holding, recording and/or guide unit is provided to form an abutment for cutting device, so that permanent separation is made during relative displacement of adhesive band in covering layer.</p> |
