| 摘要 |
The present invention relates to a flexible silicon interposer and a method for manufacturing the same and, more specifically, to a silicon wafer based integrated passive device having a bent portion which resolves a limitation of a conventional second-dimensional packaging by providing the bent portion on the silicon wafer; is able to form a portion to be bent during a process of forming a silicon-through-via, at the same time, by using a conventional deep reactive ion etching (DRIE) process; is able to easily provide the bent portion since the silicon interposer, which forms an insulating layer by a conventional spin-coating, uses a polymer laminate process; and is able to provide the flexible silicon interposer capable of being three-dimensionally bent or folded. |
