SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To inhibit increase in height of projected electrodes which are arranged on a semiconductor chip covered with a resin so as to be partially exposed from the resin thereby to achieve microfabrication and narrow pitch of the projected electrode.SOLUTION: A semiconductor package 1 comprises: a semiconductor chip 20; projected pillar electrodes 24 which are arranged on the semiconductor chip 20; and a resin 30 which covers the semiconductor chip 20 and the pillar electrodes 24. The resin 30 has a recess 31 and tips of the pillar electrodes 24 are exposed from the resin 30 on a bottom surface 31a of the recess 31. By exposing the tips of the pillar electrodes 24 from the recess 31 of the resin 30, increase in height of the pillar electrodes 24 is inhibited and microfabricated or narrow-pitched pillar electrodes 24 can be formed.