发明名称 WIRING BOARD FOR ELECTRONIC MODULE
摘要 <p>PROBLEM TO BE SOLVED: To achieve downsizing of an electronic module such as a memory card while ensuring an essential function such as increase in memory capacity.SOLUTION: A wiring board for an electronic module for arranging at least one semiconductor component on at least one principal surface of a wiring board which has at least one pair of wiring patterns arranged opposite to each other and an insulating member sandwiched between the wiring patterns so as to be electrically connected with one of the wiring patterns comprises: at least one electronic component which is embedded in the insulating member of the wiring board and electrically connected with at least one of the wiring patterns so as to be electrically connected with the semiconductor component; and an external connection terminal provided at least one principal surface of the wiring board, in which the wiring board does not include a base plate.</p>
申请公布号 JP2014150265(A) 申请公布日期 2014.08.21
申请号 JP20140046210 申请日期 2014.03.10
申请人 DAINIPPON PRINTING CO LTD 发明人 SASAOKA KENJI
分类号 H01L25/00;H01L23/12;H01L25/065;H01L25/07;H01L25/18;H05K1/18;H05K3/46 主分类号 H01L25/00
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