DIAMOND PARTICLE MOLOLAYER HEAT SPREADERS AND ASSOCIATED METHODS

摘要

Thermally regulated semiconductor devices having reduced thermally induced defects are provided, including associated methods. Such a device can include a heat spreader having a monolayer of diamond particles within a thin metal matrix and a semiconductor material thermally coupled to the heat spreader. In one aspect, the coefficient of thermal expansion difference between the heat spreader and the semiconductor material is less than or equal to about 50%.

主权项

1. A method for reducing thermally induced defects between a heat spreader and a semiconductor device, comprising:
disposing a monolayer of diamond particles within a thin metal heat spreader; and thermally coupling the heat spreader to a semiconductor material, wherein the coefficient of thermal expansion difference between the heat spreader and the semiconductor material is less than or equal to about 50%.