| 发明名称 |
APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR INTEGRATED CIRCUITS |
| 摘要 |
An apparatus includes an integrated circuit having at least one input/output terminal comprising copper formed thereon. A metal cap layer overlies an upper surface of the at least one input/output terminal. A substrate includes at least one conductive trace formed on a first surface, and a metal finish layer overlies a portion of the at least one conductive trace. A lead free solder connection is disposed between the metal cap layer and the metal finish layer, and a first intermetallic compound is disposed at an interface between the metal cap layer and the lead free solder connection. The lead free solder connection has a copper content of less than 0.5 wt. %, and the first intermetallic compound is substantially free of copper. |
| 申请公布号 |
US2014231994(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
US201414266231 |
申请日期 |
2014.04.30 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chuang Yao-Chun;Hsiao Ching-Wen;Kuo Chen-Cheng;Chen Chen-Shien |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
an integrated circuit having at least one input/output terminal comprising copper formed thereon; a metal cap layer overlying an upper surface of the at least one input/output terminal; a substrate comprising at least one conductive trace formed on a first surface; a metal finish layer overlying a portion of the at least one conductive trace; a lead free solder connection disposed between the metal cap layer and the metal finish layer; and a first intermetallic compound at an interface between the metal cap layer and the lead free solder connection, wherein the lead free solder connection has a copper content of less than 0.5 wt. %, and wherein the first intermetallic compound is substantially free of copper. |
| 地址 |
Hsin-Chu TW |
