SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC ABSORPTION AND SHIELDING

摘要

A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate (202), one or more semiconductor die (224,225), and molding compound around the one or more semiconductor die (224,225). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer (210) on the substrate (202). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.

主权项

1. A semiconductor device, comprising:
a substrate including a dielectric core, a conductive layer on the dielectric core, and a solder mask layer on the conductive layer, the substrate including an absorbing material for absorbing at least one of EMI and RFI; and one or more semiconductor die affixed to the substrate.