发明名称 MICRO-ELECTRO-MECHANICAL DEVICE WITH BURIED CONDUCTIVE REGIONS, AND MANUFACTURING PROCESS THEREOF
摘要 A MEMS device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer.
申请公布号 US2014231938(A1) 申请公布日期 2014.08.21
申请号 US201414265116 申请日期 2014.04.29
申请人 STMicroelectronics S.r.l. 发明人 Campedelli Roberto;Pezzuto Raffaella;Losa Stefano;Mantovani Marco;Azpeitia Urquia Mikel
分类号 B81B7/00;B81C1/00 主分类号 B81B7/00
代理机构 代理人
主权项 1. A MEMS device comprising: a body; a cavity above the body; first and second anchoring regions; a mobile structure above the cavity and coupled to the body by the first anchoring regions; a fixed structure above the cavity and coupled to the body by the second anchoring regions; first and second electrical-connection regions between the body and the first and second anchoring regions, respectively, the first electrical-connection region being electrically coupled to the mobile structure and the second electrical-connection region being electrically coupled to the fixed structure, wherein the first and second electrical-connection regions have a conductive multilayer that includes a first semiconductor material layer, a composite layer of a binary compound of a semiconductor material and of a transition metal, and a second semiconductor material layer.
地址 Agrate Brianza IT