| 摘要 |
A three-dimensional (3-D) integrated circuit (3DIC) with a graphene shield is disclosed. In certain embodiments, at least a graphene layer (38) is positioned between two adjacent tiers (34, 52) of the 3DIC. A graphene layer is a sheet like layer made of pure carbon, at least one atom thick with atoms arranged in a regular hexagonal pattern. A graphene layer may be disposed between any number of adjacent tiers in the 3DIC. In exemplary embodiments, the graphene layer provides an electromagnetic interference shield between adjacent tiers or layers in the 3DIC to reduce crosstalk between the tiers. In other exemplary embodiments, the graphene layer(s) can be disposed in the 3DIC to provide a heat sink that directs and dissipates heat to peripheral areas of the 3DIC. In some embodiments, the graphene layer(s) are configured to provide both EMI shielding and heat shielding. |
