METHOD FOR MANUFACTURING CARRIER FOR DOUBLE-SIDED POLISHING DEVICE AND DOUBLE-SIDED WAFER POLISHING METHOD

摘要

The present invention provides a manufacturing method for a double-sided polishing device carrier manufactured by fitting and gluing an insert material, which contacts the rim of a wafer that is held during polishing, in a holding hole, which is formed in a carrier body that is disposed between upper and lower surface plates of the double-sided polishing device on which polishing cloths are affixed and which is for holding the wafer. The method for manufacturing the double-sided polishing device carrier manufactures the double-sided polishing device carrier by performing lapping and polishing on the insert material, then fitting the insert material into the holding hole of the carrier body, and gluing and drying while applying a load on the fitted insert material along the direction perpendicular to the main surface of the carrier body. Provided thereby are a method for manufacturing a double-sided polishing device carrier and a double-sided wafer polishing method that are capable of limiting variations in polished wafer flatness within batches.