发明名称
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of transmitting high frequency signals transmitted into a signal line at low loss. SOLUTION: A wiring board comprises: a strip-shaped signal line 1; ground or power-source conductive layers 3 disposed above and below the signal line 1 with insulating layers 2 interposed therebetween; and rows of through conductors 4 that are aligned along the signal line 1 at the both sides of the signal line 1 and connect the upper and lower ground or power-source conductive layers 3 to each other. Slits 6 extending along the signal line 1 are formed between regions of the upper and lower ground or power-source conductive layers 3 facing the signal line 1 and the rows of the through conductors 4. The electromagnetic coupling of the return path formed according to signals transmitted into the signal line 1 concentrates in the regions sandwiched between the slits 6 in the ground or power-source conductive layers 3, which enables the transmission of high frequency signals transmitted into the signal line 1 at low loss. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5576261(B2) 申请公布日期 2014.08.20
申请号 JP20100289893 申请日期 2010.12.27
申请人 发明人
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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