发明名称
摘要 PROBLEM TO BE SOLVED: To provide a fluid pressure control device which improves degrees of freedom in the packaging layout of electronic components to a control board. SOLUTION: The fluid pressure control device includes a fluid pressure mechanism 8, which is provided with: a fluid pressure circuit that imparts a fluid pressure to wheel cylinders of each wheel; a solenoid valve that changes over the fluid pressure circuit; and solenoid coils 2 that drive the solenoid valve, and an electronic control device 3, which is fixed on the fluid pressure mechanism 8 and has the control board 4 that controls the solenoid coils 2. Terminals 2a of the solenoid coils 2 have extended portions 25, which are extended in parallel to the control board 4, and tip portions 26, which are bent from the one side end of the extended portions 25 toward the control board 4 and connected to the control board 4 and are connected to the control board 4 at positions closer to the edge of the control board 4 than to the terminals 2a drawing-out positions of the solenoid coils 2. COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5577314(B2) 申请公布日期 2014.08.20
申请号 JP20110205472 申请日期 2011.09.21
申请人 发明人
分类号 B60T8/34 主分类号 B60T8/34
代理机构 代理人
主权项
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