| 摘要 |
<p>The invention relates to a thermal conditioning device comprising a conditioning loop having a coolant circuit (1) and a heat-transfer fluid circuit (2), - the coolant circuit (1) comprising at least one compressor (3), one inner heat exchanger (11), one outer heat exchanger (28) and one evaporator (14), - the heat-transfer fluid circuit (2) comprising at least one first component heat exchanger (51) and/or one second component heat exchanger (52), one third component heat exchanger (67) and one radiator (69), - and a fluid/fluid heat exchanger (34) installed in the coolant circuit (1) and in the heat-transfer fluid circuit (2). The heat-transfer fluid circuit (2) comprises a first loop (47) and a second loop (48) interconnected by an interconnection device (49), the first loop (47) comprising the fluid/fluid heat exchanger (34) and the first component heat exchanger (51) and/or the second component heat exchanger (52), and the second loop (48) comprising the first component heat exchanger (51) and/or the third component heat exchanger (67) and the radiator (69).</p> |
