发明名称 CURABLE SILICONE RESINS FOR LED ENCAPSULATION
摘要 The present invention relates to a curable organopolysiloxane composition, which comprises: (A) an organocyclosiloxane having alkenyl groups, represented by the following formula (I) wherein n=3 or 4; (B) a hydrosilicone resin of formula (II) (R1R2R3SiO1/2)M.(R4R5SiO2/2)D.(R6SiO3/2)T.(SiO4/2)Q(II) wherein R1 to R5 are identical or different groups selected from organic groups and hydrogen atom, and at least one of R1 to R5 is a hydrogen atom directly bonded to a silicon atom, and on average at least two hydrogen atoms directly bonded to silicon atoms are contained in one hydrosilicone resin molecule, R6 is an organic group identical to or different from R1 to R5, as organic groups R1 to R6 may independently be linear/branched alkyl or alkenyl groups having 1-20 carbon atoms or halides thereof; cycloalkyl groups or cycloalkenyl groups having 5-25 carbon atoms or halides thereof; M, T and Q each represents a number ranging from 0 to less than 1, 0<D<1, M+D+T+Q=1, and T+Q>0; and (C) platinum-based catalysts.
申请公布号 EP2691471(A4) 申请公布日期 2014.08.20
申请号 EP20110862764 申请日期 2011.03.28
申请人 HENKEL (CHINA) CO. LTD. 发明人 TAN, WENJUAN;LI, ZHIMING;XING, WENTAO;ZHANG, LIWEI;ZHANG, YONG
分类号 C08L83/07;C08L83/04;C08L83/05;H01L23/29 主分类号 C08L83/07
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