发明名称
摘要 A multilayer resin sheet is constituted by including a resin layer containing an epoxy resin having a mesogenic skeleton, a curing agent and an inorganic filler, and an insulating adhesive layer formed on at least either of the surfaces of the resin layer. A cured multilayer resin sheet originated from the multilayer resin sheet has high thermal conductivity, good insulation and adhesive strength, and, further, superior thermal shock resistance, and is suitable as an electric insulating material to be used for an electric or electronic device.
申请公布号 JP5573842(B2) 申请公布日期 2014.08.20
申请号 JP20110534252 申请日期 2010.09.28
申请人 发明人
分类号 B32B27/38;C08G59/62;C08J7/04;C08K3/00;C08K5/54;C08L63/00 主分类号 B32B27/38
代理机构 代理人
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