| 摘要 |
PROBLEM TO BE SOLVED: To allow a recessed portion resulting from a fuse opening so that it is not formed.SOLUTION: A method of manufacturing a semiconductor device includes the steps of discharging a paste-like resin 60 from a liquid discharge head 82 to a fuse opening 13b, formed on an insulating layer 31 which is film-formed on a surface of a semiconductor wafer 50; embedding the fuse opening 13b by the paste-like resin 60 and then hardening the same; forming an embedded resin 14 formed by hardening the paste-like resin 60; forming a wiring 23 on an insulating layer 31 and embedded resin 14 due to the hardening of the paste-like resin 60; forming a columnar electrode on a columnar electrode 25 at an end of the wiring 23; and laminating a sealing layer 26 on the insulating layer 31, at the periphery of the columnar electrode 25 so that the wiring 23 is covered by the sealing layer 26. |
