发明名称 |
METHOD FOR PROVIDING A CONNECTION BETWEEN METAL MOULDED BODIES AND A POWER SEMI-CONDUCTOR WHICH IS USED TO JOIN THICK WIRES OR STRIPS |
摘要 |
The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal moulded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal moulded bodies, and applying the metal moulded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the moulded body. |
申请公布号 |
EP2766925(A1) |
申请公布日期 |
2014.08.20 |
申请号 |
EP20120769903 |
申请日期 |
2012.09.10 |
申请人 |
DANFOSS SILICON POWER GMBH |
发明人 |
BECKER, MARTIN;EISELE, RONALD;OSTERWALD, FRANK;RUDZKI, JACEK |
分类号 |
H01L21/683;H01L21/60;H01L23/485 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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