| 摘要 |
The method involves bringing an adhesive layer of an insulation device (110,111,112,114) in contact with an insulation carrier area (141,151,161,162,171,172) of the profile arrangement (100), and separating the adhesive layer from the insulation carrier area so that the insulation carrier area is free of loose particles. Another adhesive layer of the insulation device is brought in contact with the insulation carrier area of the profile arrangement so that the insulation core is fixed to the profile arrangement. The insulation carrier area is an area made of plastic, particularly polyamide. |
