| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed substrate which improves solder wicking and deals with a component having large heat capacity such as an electrolytic capacitor. SOLUTION: Hole mount components are mounted on a printed substrate 1 through flow-soldering. The printed substrate 1 includes hole mount components, for example, a component through hole 5, into which a lead terminal 3 on a negative electrode of an aluminum electrolytic capacitor is inserted, and heat receiving through holes 8 formed in positions close to the component through hole 5. The lead terminal 3 is not inserted into each heat receiving through hole 8. The heat receiving through holes 8 are disposed, for example, so as to be equally spaced and surround the component through hole 5. COPYRIGHT: (C)2012,JPO&INPIT |
