发明名称
摘要 PROBLEM TO BE SOLVED: To provide a joining method capable of reducing contact resistance between metallic members and a conductive adhesive portion when the metallic members are joined to each other via the conductive adhesive portion, and a joined body obtained by using the joining method. SOLUTION: In a joining method, a first metallic member 2 and a second metallic member 3 are joined to each other via a conductive adhesive portion. In the joining method and a joined body, a first joining auxiliary portion 6 which includes nanoparticles with an average primary particle size of 1-100 nm comprising at least one kind of metal selected from a group comprising metal constituting metallic fine particles of the conductive adhesive portion and metal constituting the first metallic member 2 is provided between the first metallic member 2 and the conductive adhesive portion, and/or a second joining auxiliary part 7 which includes nanoparticles with an average primary particle size of 1-100 nm comprising at least one kind of metal selected from a group comprising metal constituting the metallic fine particles of the conductive adhesive portion and metal constituting the second metallic member 3 is provided between the second metallic member 3 and the conductive adhesive portion. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5573557(B2) 申请公布日期 2014.08.20
申请号 JP20100219956 申请日期 2010.09.29
申请人 发明人
分类号 H05K3/40;H05K1/11;H05K3/46 主分类号 H05K3/40
代理机构 代理人
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