| 摘要 |
The present invention provides a method and an apparatus for treating a substrate with a chemical solution. The apparatus for treating a substrate includes a spin head, which supports and rotates a substrate, and an injection member which has a nozzle member which supplies the chemical solution onto the substrate supported by the spin head. The length direction of the nozzle member is parallel to the upper surface of the spin head. The nozzle member injects the chemical solution from the center region of the substrate to the edge region, thereby cleaning the center region of the substrate and the edge region at the same time. |
