| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which is used in a manufacturing phase of a semiconductor package sealed with resin, and is advantageous in reducing thickness and size of the package as well as in increasing the number of pins, and also to provide a manufacturing method of the lead frame. SOLUTION: A lead frame 1 comprises: a shape pattern formation region 2 for four pieces of semiconductor packages; and a frame portion 5 having an outer edge 3 and a boundary 4. The shape pattern formation region 2 is made thinner than the frame portion 5 by half-etching, while being provided with shapes such as an inner lead 7, an outer lead 8, and a die pad 9 formed by further etching. Also, a plurality of pilot holes 6 are formed on the outer edge 3 by the etching performed to make the inner lead 7, etc. Because the lead frame 1 is formed such that only the shape pattern formation region 2 is made thin without making the entire part flexible, a semiconductor element can be mounted without hindrance by using a conventional manufacturing apparatus. COPYRIGHT: (C)2013,JPO&INPIT |
