METHOD AND APPARATUS FOR REDUCING PRESSURE EFFECTS ON AN ENCAPSULATED DEVICE

摘要

A method and apparatus for reducing pressure effects on an encapsulated device. In one embodiment, the apparatus comprises a power module comprising an equipment box assembly containing (i) an equipment module housing, (ii) a potted electronic device disposed within the equipment module housing, and (iii) a resilient expansion absorption layer disposed between at least a portion of the potted electronic device and at least a portion of the equipment module housing.