| 摘要 |
<p>Controlling the deposition of sealant material at one or more edges of a substrate 3 of an electronic apparatus on the basis of one or more detectable marks 7 (see figure 5). The detectable marks having at least one edge that coincides with a part of at least one of said one or more edges of the substrate. The mark provides an input to a controller for adjusting the position of the application needle 30 so as to accurately deposit the sealant 24. These marks may be located at the corner of the substrate. The detectable marks are made on the substrate before it is cut; these have a large enough size to allow for any size variation in the apparatus after the cutting process. The marks may be part of the patterned layer that also defines the conductive elements for one level of an array of electronic devices.</p> |
