System for designing substrates having reference plane voids with strip segments

摘要

Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.

主权项

1. A computer system comprising a processor for executing program instructions coupled to a memory for storing the program instructions, wherein the program instructions are program instructions for execution by a processor for designing layers of a substrate for mounting and interconnecting a semiconductor die, and wherein the program instructions comprise:
program instructions for identifying locations of signal bearing vias from among a pattern of large-diameter conductive vias extending from a top side to a bottom side of a core comprising a dielectric layer; program instructions for identifying signal bearing conductive path profiles for critical signals routed above or below ends of the signal-bearing vias; and program instructions for generating a first mask design for a transmission line reference plane metal layer including voids around the profile of the signal-bearing vias so that capacitive coupling between the ends of the signal-bearing vias and the transmission line reference plane metal layer is substantially reduced, and wherein for signal bearing conductive path profiles identified by the second identifying, including a conductive stripe through the corresponding void.