| 发明名称 |
Method of manufacturing flip chip package |
| 摘要 |
A method of manufacturing a flip chip package includes: providing a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is to be mounted, and a connection pad disposed outside the mounting region; forming a resin layer on the board; forming a trench by removing a part of the resin layer or forming an uneven portion at a portion of a surface of the resin layer; forming, on the trench or uneven portion, a dam member preventing leakage of an underfill between the mounting region and the connection pad; and mounting the electronic device on the mounting region. |
| 申请公布号 |
US8809122(B2) |
申请公布日期 |
2014.08.19 |
| 申请号 |
US201314039392 |
申请日期 |
2013.09.27 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Kim Ey Yong;Shin Young Hwan;Cho Soon Jin;Kim Jong Yong;Lee Jin Seok |
| 分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a flip chip package, the method comprising:
providing a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is to be mounted, and a connection pad disposed outside the mounting region; forming a resin layer on the board; forming a trench by removing a part of the resin layer; forming a dam member on the trench, the dam member preventing leakage of an underfill between the mounting region and the connection pad; and mounting the electronic device on the mounting region. |
| 地址 |
Suwon KR |
