Chip on leads

摘要

Described herein are microelectronic packages including a plurality of bonding fingers and multiple integrated circuit chips, at least one integrated circuit chip being mounted onto the bonding fingers. According to various embodiments of the present invention, mounting the integrated circuit chip onto the bonding fingers may reduce the pin-out count by allowing multiple integrated circuit chips to be interconnected within the same microelectronic package. Other embodiments may be described and claimed.

主权项

1. A method for making a microelectronic package, the method comprising:
providing a leadframe including i) a die paddle and ii) a plurality of bonding fingers, wherein each bonding finger in a group of the plurality of bonding fingers includes (i) a first portion and (ii) a second portion, and wherein the first portion of each bonding finger in the group of the plurality of bonding fingers is down-set relative to the second portion of each bonding finger in the group of the plurality of bonding fingers; mounting a first integrated circuit chip onto the first portion of each bonding finger in the group of the plurality of bonding fingers; and mounting a second integrated circuit chip onto the die paddle; and forming a molding compound that encapsulates (i) the lead frame, (ii) the first integrated circuit chip, and (iii) the second integrated circuit chip, wherein the molding compound has (i) a first surface and (ii) a second surface that is opposite to the first surface, wherein (i) a first surface of the die paddle faces the first surface of the molding compound and (ii) a second surface of the die paddle faces the second surface of the molding compound, wherein (i) a first surface of the first portion of each bonding finger in the group of the plurality of bonding fingers faces the first surface of the molding compound and (ii) a second surface of the first portion of each bonding finger in the group of the plurality of bonding fingers faces the second surface of the molding compound, wherein (i) the first integrated circuit chip is mounted onto the first surface of the first portion of each bonding finger in the group of the plurality of bonding fingers and (ii) the second integrated circuit chip is mounted onto the first surface of the die paddle, wherein the first surface of the first portion of each bonding finger in the group of the plurality of bonding fingers is at a first distance from the first surface of the molding compound, wherein the first surface of the die paddle is at a second distance from the first surface of the molding compound, and wherein the first distance is greater than the second distance.