发明名称 |
Method and structure for a MRAM device with a bilayer passivation |
摘要 |
The present disclosure provides a magnetoresistive random access memory (MRAM) device. The MRAM device includes a magnetic tunnel junction (MTJ) stack on a substrate; and a dual-layer passivation layer disposed around the MTJ stack. The dual-layer passivation layer includes an oxygen-free film formed adjacent sidewalls of the MTJ stack; and a moisture-blocking film formed around the oxygen-free film. |
申请公布号 |
US8809976(B2) |
申请公布日期 |
2014.08.19 |
申请号 |
US201113244346 |
申请日期 |
2011.09.24 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Chih-Ming;Yu Chung-Yi;Tsai Cheng-Yuan;Cheng Kai-Wen |
分类号 |
H01L29/82;H01L43/08;H01L27/22;G11C11/16;B82Y25/00;B82Y10/00 |
主分类号 |
H01L29/82 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A magnetoresistive random access memory (MRAM) device comprising:
a magnetic tunnel junction (MTJ) stack on a substrate; a dual-layer passivation layer disposed around the MTJ stack; and a dielectric layer formed over the dual-passivation layer, the dielectric layer comprising a first material; wherein the dual-layer passivation layer includes:
a first film formed adjacent sidewalls of the MTJ stack, wherein the first film comprises a second material different from the first material and has an oxygen concentration of less than ten atomic percent, anda moisture-blocking film formed around the first film, wherein the moisture-blocking film comprises a third material different from the first and second materials and includes a metal oxide. |
地址 |
Hsin-Chu TW |