发明名称 Method and structure for a MRAM device with a bilayer passivation
摘要 The present disclosure provides a magnetoresistive random access memory (MRAM) device. The MRAM device includes a magnetic tunnel junction (MTJ) stack on a substrate; and a dual-layer passivation layer disposed around the MTJ stack. The dual-layer passivation layer includes an oxygen-free film formed adjacent sidewalls of the MTJ stack; and a moisture-blocking film formed around the oxygen-free film.
申请公布号 US8809976(B2) 申请公布日期 2014.08.19
申请号 US201113244346 申请日期 2011.09.24
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chen Chih-Ming;Yu Chung-Yi;Tsai Cheng-Yuan;Cheng Kai-Wen
分类号 H01L29/82;H01L43/08;H01L27/22;G11C11/16;B82Y25/00;B82Y10/00 主分类号 H01L29/82
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A magnetoresistive random access memory (MRAM) device comprising: a magnetic tunnel junction (MTJ) stack on a substrate; a dual-layer passivation layer disposed around the MTJ stack; and a dielectric layer formed over the dual-passivation layer, the dielectric layer comprising a first material; wherein the dual-layer passivation layer includes: a first film formed adjacent sidewalls of the MTJ stack, wherein the first film comprises a second material different from the first material and has an oxygen concentration of less than ten atomic percent, anda moisture-blocking film formed around the first film, wherein the moisture-blocking film comprises a third material different from the first and second materials and includes a metal oxide.
地址 Hsin-Chu TW