| 发明名称 | Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same | ||
| 摘要 | Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler. | ||
| 申请公布号 | US8809688(B2) | 申请公布日期 | 2014.08.19 |
| 申请号 | US201013259858 | 申请日期 | 2010.04.02 |
| 申请人 | Doosan Corporation | 发明人 | Kim Yang Seob;Kim Won Kyum;Kim Hyung Wan;Yang Dong Bo |
| 分类号 | H05K1/00 | 主分类号 | H05K1/00 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A polyamic acid solution comprising: (a) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and pyromellitic dianhydride as an aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine comprising p-phenylenediamine and 4,4′-oxydianiline; (c) an organic solvent; and (d) an inorganic filler, wherein the p-phenylenediamine and the 4,4′-oxydianiline are used in a ratio range of 55-85:15-45 mol %, said at least one aromatic tetracarboxylic acid dianhydride (a) and said at least one aromatic diamine (b) are mixed in a ratio range of a:b=1.05:1.00-1.00:1.05 mol, and the polyamic acid has a viscosity of 3,000 to 50,000 cps. | ||
| 地址 | Seoul KR | ||