发明名称 |
Process for solid electrolytic capacitors using polymer slurries |
摘要 |
A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; apply a thin polymer layer onto the dielectric, and;forming a dielectric on the porous body to form an anodized anode;;applying a first slurry to the anodized anode to form a blocking layer wherein the first slurry comprises a first conducting polymer with an median particle size of at least 0.05 μm forming a layer of crosslinker on the blocking layer; and;applying a layer of a second conducting polymer on the layer of crosslinker. |
申请公布号 |
US8808403(B2) |
申请公布日期 |
2014.08.19 |
申请号 |
US201113232325 |
申请日期 |
2011.09.14 |
申请人 |
Kemet Electronics Corporation |
发明人 |
Qiu Yongjian;Hahn Randolph S.;Key Kristen;Chen Qingping |
分类号 |
H01G9/00;B05D1/38;C23C28/00;B05D3/10;B05D1/18;B05D5/12;B05D3/00;H01G9/028;H01G9/15 |
主分类号 |
H01G9/00 |
代理机构 |
Perkins Law Firm, LLC |
代理人 |
Guy Joseph T.;Perkins Law Firm, LLC |
主权项 |
1. A process for forming a solid electrolytic capacitor comprising:
providing an anode wherein said anode comprises a porous body and an anode wire extending from said porous body; forming a dielectric on said porous body to form an anodized anode; and applying a first slurry to said anodized anode to form a blocking layer wherein said first slurry comprises a first conducting polymer with a median particle size of at least 0.05 μm; forming a layer of crosslinker on said blocking layer; and
applying a slurry of a second conducting polymer on said layer of crosslinker. |
地址 |
Simpsonville SC US |