摘要 |
The present invention relates to a finishing tape treating device which automatically folds a finishing tape in half in order to prevent a member wound on a reel from being released from the reel arbitrarily, and a semiconductor carrier winding apparatus which includes the finishing tape treating device. The finishing tape treating device according to an embodiment of the present invention is mounted on the winding apparatus which comprises a guide track part for moving a band-shaped carrier; and a carrier reel mounted at the rear of the guide track part for winding the carrier so as to process a finishing tape attached to an end portion of the carrier which is wound on the carrier reel. The finishing tape treating device comprises: a feed part mounted on the guide track part to feed the finishing tape to the upper portion of the carrier which moves along the guide track part; a cutting part for cutting the finishing tape; a pressing part for pressing the finishing tape to bond the finishing tape to the carrier moving along the guide track part; and a finishing processing part for folding the cut portion of the finishing tape cut by the cutting part to form a hand-grip part. |