发明名称 EUV mirror module with a nickel electroformed curved mirror
摘要 An EUV mirror module is disclosed that comprises a substrate with a curved upper surface and a curved electroformed mirror. A self-adjusting bonding material is disposed between the substrate and the electroformed mirror. The bonding material is flowable at a melting temperature and self-adjusts to conformally fill the region between substrate to the electroformed mirror and bond the substrate and the electroformed mirror. The substrate may have at least one cooling channel for cooling the mirror module.
申请公布号 US8810775(B2) 申请公布日期 2014.08.19
申请号 US201012799016 申请日期 2010.04.16
申请人 Media Lario S.R.L. 发明人 Kools Jacques
分类号 G03F7/20;G02B7/18;G02B5/08 主分类号 G03F7/20
代理机构 Opticus IP Law PLLC 代理人 Opticus IP Law PLLC
主权项 1. An extreme ultraviolet (EUV) mirror module for use with EUV radiation, comprising: a substrate made of either nickel, nickel alloy, silicon or silicon-carbide and having a body with a curved upper surface that has surface irregularities, a first curvature and a first surface accuracy, the substrate having at least one cooling channel having cooling channel portions; a nickel electroformed mirror having front and rear curved surfaces and having a thickness of between 1 mm and 2 mm, the front and rear curved surfaces having a second curvature with a second surface accuracy that is greater than the first surface accuracy, wherein the second surface accuracy is at least 1 micron root-mean square (RMS), and wherein the first curvature approximately matches the second curvature; and a self-adjusting metallic conductive bonding material disposed in a region between the substrate curved upper surface and the electroformed mirror curved rear surface, the bonding material being flowable at a melting temperature to have a thickness between 10 microns and 1000 microns that conformally fills the region and fills the substrate surface irregularities, and bonds the substrate to the electroformed mirror at a temperature below the melting temperature while establishing thermal contact between the substrate and the electroformed mirror.
地址 Bosisio Parini (LC) IT