发明名称 HOUSING, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE USING SAME
摘要 The present invention provides an electronic device comprising a plurality of electronic components and a housing forming a space for accommodating the electric components. The housing includes a first exterior member having at least one metal member and a non-metallic second exterior member coupled to the first exterior member.
申请公布号 KR20140101240(A) 申请公布日期 2014.08.19
申请号 KR20130014674 申请日期 2013.02.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JONG CHUL;MOOM, HEE CHEUL;JUNG, IK SU
分类号 H05K5/03;H01Q1/24;H04B1/38 主分类号 H05K5/03
代理机构 代理人
主权项
地址