发明名称 |
HOUSING, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE USING SAME |
摘要 |
The present invention provides an electronic device comprising a plurality of electronic components and a housing forming a space for accommodating the electric components. The housing includes a first exterior member having at least one metal member and a non-metallic second exterior member coupled to the first exterior member. |
申请公布号 |
KR20140101240(A) |
申请公布日期 |
2014.08.19 |
申请号 |
KR20130014674 |
申请日期 |
2013.02.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, JONG CHUL;MOOM, HEE CHEUL;JUNG, IK SU |
分类号 |
H05K5/03;H01Q1/24;H04B1/38 |
主分类号 |
H05K5/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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