| 发明名称 | Integrated circuit packaging system with plated leads and method of manufacture thereof | ||
| 摘要 | An integrated circuit packaging system and method of manufacture thereof including: providing a leadframe having unprocessed leads; depositing an etch mask on a top surface of the unprocessed leads, the unprocessed leads having the etch mask and an unmasked portions of the top surface; connecting an integrated circuit die to the unprocessed leads; encapsulating with a package body the leadframe, the top surface of the unprocessed leads exposed from the package body; forming side-solderable leads including forming a groove in the unprocessed leads, the groove formed under a portion of the etch mask including forming an overhang of the etch mask over the groove; removing the etch mask; and depositing a plating on the side-solderable leads. | ||
| 申请公布号 | US8809119(B1) | 申请公布日期 | 2014.08.19 |
| 申请号 | US201313896608 | 申请日期 | 2013.05.17 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Espiritu Emmanuel;Bathan Henry Descalzo;Do Byung Tai |
| 分类号 | H01L21/44;H01L21/48;H01L21/50;H01L23/495 | 主分类号 | H01L21/44 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method of manufacture of an integrated circuit packaging system comprising: providing a leadframe having unprocessed leads; depositing an etch mask on a top surface of the unprocessed leads, the unprocessed leads having the etch mask and unmasked portions of the top surface; connecting an integrated circuit die to the unprocessed leads; encapsulating with a package body the leadframe, the top surface of the unprocessed leads exposed from the package body; forming side-solderable leads including forming a groove in the unprocessed leads, the groove formed under a portion of the etch mask including forming an overhang of the etch mask over the groove; removing the etch mask; and depositing a plating on the side-solderable leads. | ||
| 地址 | Singapore SG | ||