Integrated power converter package with die stacking

摘要

An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.

主权项

1. A semiconductor device comprising:
a first semiconductor die comprising a first switching device; a second semiconductor die comprising a second switching device, the second semiconductor die having a top surface that is electrically connected to electrical ground; a lead frame structure comprising at least a first section supporting the first semiconductor die and a second section supporting the second semiconductor die, the first semiconductor die having a bottom surface that is on the first section of the lead frame structure, the second semiconductor die having a bottom surface that is on the second section of the lead frame structure; and a third semiconductor die that is vertically stacked on the second semiconductor die, the third semiconductor die comprising a control circuit and having a bottom surface that is attached to the top surface of the second semiconductor die.