Seal ring structure with capacitor

摘要

A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate of a conductivity type having a chip region enclosed by a seal ring region. An insulating layer is on the semiconductor substrate. A seal ring structure is embedded in the insulating layer corresponding to the seal ring region. A capacitor is disposed under the seal ring structure and is electrically connected thereto, wherein the capacitor includes a body of the semiconductor substrate.

主权项

1. A semiconductor device, comprising:
a semiconductor substrate of a first conductivity type having a chip region enclosed by a seal ring region; an insulating layer on the semiconductor substrate; a first seal ring structure embedded in the insulating layer corresponding to the seal ring region; and a first capacitor disposed under the first seal ring structure and electrically connected thereto, wherein the first capacitor comprises: a body of the semiconductor substrate; an isolation structure formed in the semiconductor substrate of the seal ring region; a first polysilicon layer interposed between the isolation structure and the first seal ring structure and enclosing the chip region; and at least one opening cutting the isolation structure and the first polysilicon layer off.