发明名称 Wired circuit board having first and second conductive patterns with respective connecting portions formed on first and second insulating layers
摘要 A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.
申请公布号 US8809691(B2) 申请公布日期 2014.08.19
申请号 US201213554799 申请日期 2012.07.20
申请人 Nitto Denko Corporation 发明人 Ohsawa Tetsuya
分类号 H05K1/03;G11B5/48;H05K1/05 主分类号 H05K1/03
代理机构 Edwards Neils PLLC 代理人 Edwards Jean C.;Edwards Neils PLLC
主权项 1. A wired circuit board, comprising: an insulating layer; and a conductive layer formed on the insulating layer, wherein the insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer, the conductive layer includes a first conductive pattern, and a second conductive pattern provided independently of the first conductive pattern, the first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured to be electrically connected to the first connecting portion so as to be electrically connected to an external electronic element, the at least one pair of first terminals being provided to be spaced apart from each other to allow the electronic element to be disposed at the at least one pair of first terminals to extend therebetween, and the second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to be electrically connected to a magnetic head provided on an external slider.
地址 Osaka JP
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